Cooling system having fins

ABSTRACT

A cooling system is disclosed in which the cooling system comprises a first manifold for receiving a thermal medium from a source, the first manifold having an output port, a second manifold for returning a thermal medium to a source, the second manifold having an input port, a conduit connected between the output port of the first manifold and the input port of the second manifold, and a fin assembly in thermal communication with the conduit.

BACKGROUND

This disclosure relates to a heat exchange apparatus and more particularly to a cooling system having fins for cooling ambient air.

Cooling or air conditioning systems are used to cool air within a closed structure or building to provide comfort during hot weather. An air conditioning system can include components such as a condensing coil, an expansion valve, an evaporator coil, a compressor, and a fan. A central air conditioning system uses all of these components and distributes cooled air into one or more rooms through ducts, vents, and a fan. However, such forced air systems have several disadvantages. Some disadvantages are uneven cooling in a room, dust and other allergens being circulated within a room, noise due to a fan blowing air through the vents, and placement of a thermostat in one room causing uneven cooling in other rooms. There are also losses in the duct system due to heat transfer from the cold air to the warmer duct.

A cooling plate is another known system that is used to cool air within a structure. A cooling plate consist of a large flat metal plate that includes a piping system attached to the back of the plate. The plate is installed on the ceiling and is parallel to the floor. Chilled water is passed though the piping system and a heat transfer takes place. Since heat moves from a hot surface to a cold surface, the warmer air surrounding the cooling plate is cooled by the chilled water. The water carries the heat away cooling the surrounding air beneath the plate. This cooled air falls and cools the space as it displaces warmer air below. The displaced warmer air rises and interacts with the plate and the process is repeated.

Although a cooling plate is useful the plate system also has a few disadvantages associated with its use. One disadvantage is that the cooling plate needs a surface area of at least 50% of the space that is to be cooled. This means that a 10,000 square foot building would require at a minimum 5,000 square feet of cooling plates to satisfy this requirement. Since cooling plates cost in the range of $50 to $100 per square foot, this is a very expensive proposition in a large space. Further, in the 10,000 square foot building at least half of the ceiling will be covered by the cooling plates. In the case where there are many lights, structural issues, or other obstacles in the way cooling plates may not be a satisfactory or viable option.

Another disadvantage associated with the use of a cooling plate is that the plate have to be operated above dew point. When the surrounding humidity level is above the temperature of the chilled water, moisture will form on the cooling plate. This will cause water drops to form and then fall on the space below. This is prevented by operating the cooling plate above dew point. Dehumidification is important in the operation of the cooling plate. However, dehumidification impacts the temperature of the chilled water that can be sent through the system. This then impacts the effectiveness of the cooling plate because the plate cannot be operated at a temperature low enough to cool the space. In this situation, additional cooling plates must be used which take up more than the 50% space typically required. This results in a more expensive system. Further, since more ceiling space is required other compromises may have to be made. For example, there may be less space for lights on the ceiling which results in a less than sufficient lighted space.

Therefore, it would be desirable to have a cooling system that is efficient and provides even cooling to a space. It would also be advantageous to have a cooling system takes up the minimal amount of ceiling space when installed on a ceiling while providing a maximum amount of cooling.

BRIEF SUMMARY

In one form of the present disclosure, a cooling system comprises a first manifold for receiving a thermal medium from a source, the first manifold having an output port, a second manifold for returning a thermal medium to a source, the second manifold having an input port, a conduit connected between the output port of the first manifold and the input port of the second manifold, and a fin assembly in thermal communication with the conduit.

In another form of the present disclosure, a cooling system comprises a first manifold for receiving a thermal medium from a source, the first manifold having a plurality of output ports, a second manifold for returning a thermal medium to a source, the second manifold having a plurality of input ports, a plurality of conduits with each conduit being connected between one of the output ports of the first manifold and one of the input ports of the second manifold, and a plurality of fin assemblies with each fin assembly being in thermal communication with one of the conduits.

In yet another form of the present disclosure, a cooling device for positioning in a room having vertical extending walls comprises a supply manifold for receiving a thermal medium from a source, the first manifold having an output port, a return manifold for returning a thermal medium to a source, the return manifold having an input port, a conduit connected to the output port of the supply manifold and the input port of the return manifold for providing a thermal medium from the supply manifold to the return manifold, and a fin assembly in thermal communication with the conduit.

In light of the foregoing comments, it will be recognized that a principal object of the present disclosure is to provide a cooling system having fins.

A further object of the present disclosure is to provide a cooling system which is of simple construction and design, is inexpensive, and which can be easily employed with highly reliable results.

Another object of the present disclosure is to provide a cooling system that is easy to use and install and may be positioned on a ceiling.

A still further object of the present disclosure is to provide a cooling system that takes up a minimal amount of ceiling space and has a maximum amount of cooling surface.

A further object of the present disclosure is to provide a cooling system that may be positioned around various obstacles or objects found on a ceiling.

Another object of the present disclosure is to provide a cooling system that may be easily serviced once installed.

Yet another object of the present disclosure is to provide a cooling system that may be connected to any source that can provide a thermal medium.

These and other advantages of the present disclosure will become apparent after considering the following detailed specification in conjunction with the accompanying drawings, wherein:

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of a cooling system having fins constructed according to the present disclosure;

FIG. 2 is a partial bottom view partially broken away of the cooling system constructed according to the present disclosure;

FIG. 3 is a perspective view of an input manifold constructed according to the present disclosure;

FIG. 4 is a cross sectional view of a fin assembly constructed according to the present disclosure;

FIG. 5 is a side view of a fin portion constructed according to the present disclosure;

FIG. 6 is a side view of a first manifold and a plurality of fin assemblies of the cooling system constructed according to the present disclosure;

FIG. 7 is a back view of a second manifold and a cross sectional view of a plurality of fin assemblies of the cooling system constructed according to the present disclosure; and

FIG. 8 is a side view of a fin assembly connected between a first manifold and a second manifold constructed according to the present disclosure.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Referring now to the drawings, wherein like numbers refer to like items, number 10 identifies a preferred embodiment of a cooling system constructed according to the present disclosure. With reference now to FIG. 1, the cooling system 10 is shown to comprise a first or input manifold 12 having an input 14 for receiving a thermal medium, such as chilled water, from a source 16 via a supply conduit or a supply line 18. The first manifold 12 has an output port 20 that is connected to a conduit 22. The conduit 22 is connected to an input port 24 associated with a second or output manifold 26. The second manifold 26 has an output port 28 that is connected to a return conduit or a return line 30 that is connected to the source 16. The source 16 may be any system that provides a thermal medium such as chilled water such as a geothermal system or a refrigeration system. The cooling system 10 further comprises a fin assembly 32 that is in thermal communication with the conduit 22. As can be appreciated, a thermal medium may be circulated from the source 16 through the supply conduit 18, the first manifold 12, the conduit 22, the second manifold 26, and the return conduit 30. As the thermal medium flows through the conduit 22, the fin assembly 32 is cooled or chilled. Any air passing by the fin assembly 32 is also cooled or chilled. The manifolds 12 and 26, the ports 20 and 24, and the conduit 22 may be constructed of copper or any other similar material. Further, the supply conduit 18 and the return conduit 30 may be insulated pipes or tubes to increase the energy transfer efficiency when chilled water is used.

With reference now to FIG. 2, a partial bottom view of the cooling system 10 is shown. The cooling system 10 is depicted comprising the first or input manifold 12 for receiving a thermal medium from a source (not shown). The first manifold 12 has the input port 14 connected to the supply conduit 18. The first manifold 12 has a plurality of output ports such as output ports 50, 52, 54, and 56. Although four output ports 50, 52, 54, and 56 are shown, it is possible to have more or less output ports as will be discussed further herein. The system 10 also has the second manifold 26 for returning the thermal medium to the source. The second manifold 26 has the output port 28 that is connected to the return conduit 30. The second manifold 26 has a plurality of input ports such as input ports 58, 60, 62, and 64. Again, although only four input ports 58, 60, 62, and 64 are illustrated, it is also contemplated to have more or less input ports. As can be appreciated, the number of output ports associated with the first manifold 12 will be the same as the number of input ports associated with the second manifold 26.

Connected between each of the output ports 50, 52, 54, and 56 of the first manifold 12 and the input ports 58, 60, 62, and 64 of the second manifold 26 is the conduit or cross tubes 22. Each of the conduits 22 has a fin assembly 32 attached around the conduit 22 and in thermal communication with the conduit 22. The thermal medium is adapted to flow through the supply conduit 18, the first manifold 12, the output ports 50, 52, 54, and 56, the conduit 22, the second manifold 26, and the return conduit 30. As the thermal medium flows through each of the conduits 22, each of the fin assemblies 32 will be cooled or chilled.

The system 10 may also include hardware, such as a plurality of straps 66, that may be used to suspend the first manifold 12 and the second manifold 26 from a ceiling (not shown). Other hardware or structural devices may be used to suspend or connect the system 10 to a ceiling. For example, although not shown, the straps 66 may be connected to standoffs which are screwed into a ceiling. Further, the straps 66 may be C-shaped to fit completely around the manifolds 12 and 26.

Referring now to FIG. 3, the input manifold 12 is shown. The input manifold 12 comprises the input port 14 that is adapted to be connected to the supply conduit 18 (not shown). The first manifold 12 has a plurality of output ports such as output ports 80, 82, 84, 86, 88, 90, 92, 94, 96, 98, 100, and 102 extending out of a manifold body 104. The output ports 80, 82, 84, 86, 88, 90, 92, 94, 96, 98, 100, and 102 and the manifold body 104 are hollow and cylindrical in shape. This allows any thermal medium flowing into the manifold 12 to flow out of the output ports 80, 82, 84, 86, 88, 90, 92, 94, 96, 98, 100, and 102. The output manifold 26 is constructed in the same manner.

FIG. 4 illustrates a cross sectional view of a fin assembly 100 constructed according to the present disclosure being positioned around and in thermal communication with the conduit 22. The fin assembly 100 comprises a first or upper fin portion 102 connected to a second or lower fin portion 104. The first fin portion 102 has a first or upper planar section 106, a second or lower planar section 108, and a semi-circular section 110 intermediate the first section 106 and the second section 108. The upper planar section 106 has a length that is greater than the length of the lower planar section 108. By way of example only, the length of the first planar section 106 may be 4.5 inches and the length of the second planar section 108 may be 1 inch. The section 110 is shaped to fit around the exterior radius of the conduit 22. The first fin portion 102 and the second fin portion 104 may be constructed of any material that easily and efficiently conducts heat such as aluminum.

The second fin portion 104 has a first or upper planar section 112, a second or lower planar section 114, and a semi-circular section 116 intermediate the first section 112 and the second section 114. The lower planar section 114 has a length that is greater than the length of the upper planar section 112. Again, by way of example only, the length of the lower planar section 114 may be 4.5 inches and the length of the upper planar section 112 may be 1 inch. The section 116 is shaped to fit around the exterior radius of the conduit 22.

The first fin portion 102 and the second fin portion 104 are connected together by use of a pair of rivets, such as pop rivets 118 and 120. The rivet 118 connects the upper planar section 106 of the first fin portion 102 to the upper planar section 112 of the second fin portion 104. The rivet 120 connects the lower planar section 108 of the first fin portion 102 to the lower planar section 114 of the second fin portion 104. Although rivets 118 and 120 are shown connecting the fin portions 102 and 14 together, it is possible that are connecting devices or methods may be employed. For example, the fin portions 102 and 104 may be welded together. An adhesive may be used to connect the fin portions 102 and 104 together. Bolts, nuts, screws, and other devices which would allow the fin portions 102 and 104 to be connected together and easily separated for repair may be used.

With particular reference now to FIG. 5, the first fin portion 102 is shown being disconnected from the second fin portion 104 and removed from around the conduit 22. The first fin portion 102 has the first or upper planar section 106, the second or lower planar section 108, and the semi-circular section 110 intermediate the first section 106 and the second section 108. The upper planar section 106 has a length that is greater than the length of the lower planar section 108. As has been previously indicated and by way of example only, the length of the first planar section 106 may be 4.5 inches and the length of the second planar section 108 may be 1 inch. Of course, the lengths of the first planar second 106 and the second planar section 108 may be adjusted as required by the system 10. For example, there may be situations where the lengths of the first planar section 106 and the second planar section 108 may be equal. Further, there may be installations which require the length of the first planar section 106 to be larger or smaller than 4.5 inches. The section 110 is shaped to fit around the exterior radius of the conduit 22. However, it is possible that the intermediate section 110 may be any shape that is capable of fitting over the conduit 22. For example, if for some reason the conduit 22 is rectangular in shape then the intermediate section 110 will have a rectangular shape. The second fin portion 104 is similar in construction as the just described first fin portion 102.

FIG. 6 depicts a partial side view of the first manifold 12 and a five fin assemblies 150, 152, 154, 156, and 158 of the cooling system 10. The fin assembly 150 comprises a first fin portion 160 connected to a second fin portion 162 by use of a pair of rivets 164 and 166. As has been previously discussed in detail, the first fin portion 160 is similar to the first fin portion 102 and the second fin portion 162 is similar to the second fin portion 104. The fin assembly 150 has a front surface 168 associated with the first fin portion 160, a front surface 170 associated with the second fin portion 162, a back surface 172 associated with the first fin portion 160, and a back surface 174 associated with the second fin portion 162. The fin assembly 150 has a bottom surface 176 and a top surface 178. The fin assemblies 150, 152, 154, 156, and 158 are orientated parallel to the walls of a building. As hot air rises in a building, the hot air will come in contact with the sides of the fin assemblies 150, 152, 154, 156, and 158 and the air will be cooled. For example, air will move by the surfaces 168, 170, 172, and 174 from the bottom 176 to the top 178. As the hot air is cooled the cool air falls to cool a space. This creates a chimney effect and also creates airflow due to the cooling of hot air. Also, air flows between the fin assemblies 150, 152, 154, 156, and 158. For example, a channel or passage 180 is formed between the fin assembly 152 and the fin assembly 154 and air may flow through the channel 180. Heat is absorbed by the cooling system 10 and there may be a temperature difference between the first manifold 12 and the second manifold 26. By way of example only, there may be a 10° difference between the manifolds 12 and 26 with the second manifold 26 being 10° hotter than the first manifold 12. Although only five fin assemblies are shown it is possible to have more or less fin assemblies depending upon the particular application.

Referring now to FIG. 7, a back view of the second manifold 26 and a cross sectional view of a plurality of fin assemblies 190 are shown. Each of the fin assemblies 190 is adapted to fit around the conduits 22 to be in thermal communication with the conduits 22. The fin assemblies 190 are shown to be of unitary construction 192 instead of the two fin portions 102 and 104. In this manner the fin assemblies 190 may be slid over the conduit 22. Each fin assembly 190 has an upper planar portion 194, a lower planar portion 196, and a circular portion 198 intermediate the upper planar portion 194 and the lower planar portion 196. The fin assemblies 190 are orientated in a vertical orientation which is parallel to the walls of a structure. In this manner the chimney effect is created and warm or hot air which flows by and between the fin assemblies 190 is cooled.

FIG. 8 illustrates a side view of a fin assembly 200 connected between the first manifold 12 and the second manifold 26 around the conduit 22. The fin assembly 200 comprises an upper fin portion 202 and a lower fin portion 204 connected together by a plurality of rivets 206. The upper fin portion 202 and the lower fin portion 204 provide a front surface 208 and a back surface, not shown in this particular view, that allows hot or warm air to pass. As the hot air passes by the front surface 208 it is cooled due to the fin assembly 200 being cooled by a thermal medium flowing from the first manifold 12 through the conduit 22 to the second manifold 26.

As can be appreciated, the system 10 may be installed in a building to effectively cool a space. By way of example only, the system 10 can cool a 10,000 square foot building by taking up only 570 square feet of the ceiling. The system 10 may be constructed by using a fin assembly of 10 feet long by 2 feet wide. This only takes up 20 square feet of the ceiling. As has been previously described, the fins themselves may be 9 inches wide and 9 feet 9 inches long. Since both sides of the fin come into contact with the air in the space being cooled both sides are calculated into the surface area of cooling for the fin. In the 20 square foot section there can be placed 12 fins which provides 175.5 square feet of cooling surface. In a 10,000 square foot building only 570 square feet of the ceiling will be filled with the system 10 compared to a minimum of 5,000 square feet required by a cooling plate system. This is approximately an 89% reduction in required ceiling space. Additional fin assemblies may be added without concern of compromising the number of lights required to illuminate the space. Further, it there are any structural issues, the system 10 can easily be tailored or designed to avoid such structural issues. As can further be appreciated, the system 10 can be connected to various thermostats to cool various areas of a space.

From all that has been said, it will be clear that there has thus been shown and described herein a cooling system having fins which fulfills the various advantages sought therefore. It will become apparent to those skilled in the art, however, that many changes, modifications, variations, and other uses and applications of the subject cooling system having fins are possible and contemplated. All changes, modifications, variations, and other uses and applications which do not depart from the spirit and scope of the disclosure are deemed to be covered by the disclosure, which is limited only by the claims which follow. 

1. A cooling system comprising: a first manifold for receiving a thermal medium from a source, the first manifold having an output port; a second manifold for returning a thermal medium to a source, the second manifold having an input port; a conduit connected between the output port of the first manifold and the input port of the second manifold; and a fin assembly in thermal communication with the conduit.
 2. The cooling system of claim 1 wherein the fin assembly comprises a first fin portion and a second fin portion.
 3. The cooling system of claim 2 wherein the first fin portion comprises a first planar section, a semi-circular section, and a second planar section.
 4. The cooling system of claim 3 wherein the first planar section has a length and the second planar section has a length and the length of the first planar section is greater than the length of the second planar section.
 5. The cooling system of claim 2 wherein the second fin portion comprises a first planar section, a semi-circular section, and a second planar section.
 6. The cooling system of claim 5 wherein the first planar section has a length and the second planar section has a length and the length of the first planar section is greater than the length of the second planar section.
 7. The cooling system of claim 1 wherein the fin assembly comprises a first fin portion having a first planar section, a semi-circular section, and a second planar section, a second fin portion having a first planar section, a semi-circular section, and a second planar section, the first planar section of the first fin portion being connected to the second planar section of the second fin portion and the first planar section of the second fin portion being connected to the second planar section of the first fin portion.
 8. The cooling system of claim 7 wherein the semi-circular section of the first fin portion and the semi-circular section of the second fin portion fit around the conduit.
 9. A cooling system comprising: a first manifold for receiving a thermal medium from a source, the first manifold having a plurality of output ports; a second manifold for returning a thermal medium to a source, the second manifold having a plurality of input ports; a plurality of conduits with each conduit being connected between one of the output ports of the first manifold and one of the input ports of the second manifold; and a plurality of fin assemblies with each fin assembly being in thermal communication with one of the conduits.
 10. The cooling system of claim 9 wherein each fin assembly comprises a first fin portion and a second fin portion.
 11. The cooling system of claim 10 wherein the first fin portion comprises a first planar section, a semi-circular section, and a second planar section
 12. The cooling system of claim 11 wherein the second fin portion comprises a first planar section, a semi-circular section, and a second planar section.
 13. The cooling system of claim 12 wherein the first planar section of the first fin portion is connected to the second planar section of the second fin portion and the first planar section of the second fin portion is connected to the second planar section of the first fin portion.
 14. The cooling system of claim 13 wherein the fin portions are connected together by rivets.
 15. A cooling device for positioning in a room having vertical extending walls, the cooling device comprising: a supply manifold for receiving a thermal medium from a source, the first manifold having an output port; a return manifold for returning a thermal medium to a source, the return manifold having an input port; a conduit connected to the output port of the supply manifold and the input port of the return manifold for providing a thermal medium from the supply manifold to the return manifold; and a fin assembly in thermal communication with the conduit.
 16. The cooling device of claim 15 wherein the fin assembly is orientated in a vertical position parallel to the vertical walls to allow air to flow passed the fin assembly.
 17. The cooling reader device of claim 15 wherein the fin assembly comprises a first fin portion and a second fin portion.
 18. The cooling device of claim 15 wherein the fin assembly comprises a first fin portion having a first planar section, a semi-circular section, and a second planar section, a second fin portion having a first planar section, a semi-circular section, and a second planar section, the first planar section of the first fin portion being connected to the second planar section of the second fin portion and the first planar section of the second fin portion being connected to the second planar section of the first fin portion.
 19. The cooling device of claim 18 wherein the semi-circular section of the first fin portion and the semi-circular section of the second fin portion fit around the conduit.
 20. The cooling device of claim 15 wherein the supply manifold further comprises a port connected to a supply of a source of a thermal medium and the return manifold further comprises a port connected to a return of a source of a thermal medium. 